| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can supply uniform inputs to a plurality of signal processing circuits in a state where light is blocked; and which enables measurement after packaging without influencing characteristics of an optical sensor device; and which requires less area necessary for a mechanism for evaluation.SOLUTION: A semiconductor device comprises a plurality of imaging devices formed on a semiconductor substrate. The imaging device includes a photodiode 1, a current/voltage conversion circuit 7, wiring 2 for connecting the photodiode 1 and the current/voltage conversion circuit 7, a conductive layer 5 to which a test signal is input, and an inter-wire capacitance 6 composed of the wiring 2 and the conductive layer 5. The conductive layer 5 is arranged between the photodiode 1 and the current/voltage conversion circuit 7 of each imaging device. Uniform inputs can be supplied to a plurality of signal processing circuits in a state where light is blocked. Measurement after packaging is enabled without influencing characteristics of an optical sensor thereby to improve accuracy in dispersion evaluation. |
