发明名称 WIRING SUBSTRATE
摘要 A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and connection terminals. The main body includes opposing first side surfaces, opposing second side surfaces, and opposing third side surfaces. The connection terminals cover the first side surfaces. First projections project from walls of the through hole toward the first side surfaces. Each first projection includes a distal end that contacts one of the connection terminals. Second projections project from walls of the through hole toward the second side surfaces. The opposing second projections include distal ends spaced apart by a distance longer than the distance between the second side surfaces and shorter than the distance between two farthest points on a periphery of each first side surface.
申请公布号 US2014104797(A1) 申请公布日期 2014.04.17
申请号 US201314050505 申请日期 2013.10.10
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 MACHIDA TAKEMI;TAKIZAWA DAISUKE
分类号 H05K1/18 主分类号 H05K1/18
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