| 摘要 |
According to the present invention, a light emitting diode package includes: a supporting part; a housing having an edge part formed around an edge of the supporting part; a chip mounting part on which multiple light emitting diode chips are separately mounted; a circuit part formed to electrically connect the emitting light diodes mounted in the chip mounting part; a circuit-type lead frame which has a lead part electrically connected with the circuit part and is mounted to insulate the supporting part from the chip mounting par and the circuit part; and an insulating member formed to insulate the housing and the lead part. |
