| 摘要 |
The present invention relates to a tool for attaching solder balls and a method for attaching solder balls using the same. The tool for attaching solder balls which is used to mount solder balls on a predetermined material to be arranged in multiple pattern forms which have multiple rows and columns by arranging patterns where multiple solder balls are mounted on predetermined locations adjacently in longitudinal and traverse directions. The tool for attaching solder balls comprises: a first ball suction unit which has a first reception surface which sucks and receives solder balls in solder ball arrangement pattern corresponding to a first area corresponding to a part of rows among the patterns, and has a suction chamber capable of applying suction pressure to the first reception surface; and a second ball suction unit which has a second reception unit which sucks and receives solder balls in a solder ball arrangement pattern corresponding to a second area corresponding to another part of rows among the patterns and is located to be separated from the first reception surface, and has a second suction chamber capable of applying suction pressure to the second reception surface independently from applying suction pressure to the first reception surface. As a result, although a solder ball size becomes smaller and an internal between solder balls becomes narrower, the tool for attaching solder balls and the method for attaching solder balls using the same can accurately attach solder balls at predetermined locations on a material. |
