发明名称 ETCHING OF BLOCK-COPOLYMERS
摘要 <p>The present invention relates to a method for block-copolymer lithography. This method includes a step (12) of obtaining a self-organization block-copolymer layer including at least two polymer elements of mutually different etch resistance, and a step of applying the first plasma etching (14) of the self-organization block-copolymer layer by using plasma actually generated from a delamination gas and the second plasma etching (14) of the self-organization block-copolymer layer by using plasma actually generated from an pure inactive gas or the mixture of an inactive gas to selectively remove the first polymer at least once. A corresponding intermediate product is also described. [Reference numerals] (12) Provide a BCP layer on a substrate; (14) Perform a first plasma etching using a delamination gas; (16) Perform a second plasma etching using an inactive gas or mixture thereof; (18) Provide a pre-mask on the substrate</p>
申请公布号 KR20140043694(A) 申请公布日期 2014.04.10
申请号 KR20130117961 申请日期 2013.10.02
申请人 IMEC;TOKYO ELECTRON LIMITED 发明人 CHAN BOON TEIK;TAHARA SHIGERU
分类号 H01L21/3065;H01L21/027 主分类号 H01L21/3065
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