发明名称 |
ETCHING OF BLOCK-COPOLYMERS |
摘要 |
<p>The present invention relates to a method for block-copolymer lithography. This method includes a step (12) of obtaining a self-organization block-copolymer layer including at least two polymer elements of mutually different etch resistance, and a step of applying the first plasma etching (14) of the self-organization block-copolymer layer by using plasma actually generated from a delamination gas and the second plasma etching (14) of the self-organization block-copolymer layer by using plasma actually generated from an pure inactive gas or the mixture of an inactive gas to selectively remove the first polymer at least once. A corresponding intermediate product is also described. [Reference numerals] (12) Provide a BCP layer on a substrate; (14) Perform a first plasma etching using a delamination gas; (16) Perform a second plasma etching using an inactive gas or mixture thereof; (18) Provide a pre-mask on the substrate</p> |
申请公布号 |
KR20140043694(A) |
申请公布日期 |
2014.04.10 |
申请号 |
KR20130117961 |
申请日期 |
2013.10.02 |
申请人 |
IMEC;TOKYO ELECTRON LIMITED |
发明人 |
CHAN BOON TEIK;TAHARA SHIGERU |
分类号 |
H01L21/3065;H01L21/027 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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