发明名称 LAMINATE, ELECTROCONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT
摘要 <p>The present invention relates to a laminate characterized in having: a layer (I) comprising a support body containing a specific polyimide resin; a resin layer (II) for receiving a fluid containing an electroconductive substance (x); and an electroconductive layer (III) formed by the electroconductive substance (x). The present invention further relates to an electroconductive pattern and an electric circuit. This laminate has excellent adhesion between the layer comprising a support body and the resin layer for receiving an electroconductive substance and can maintain an excellent adhesion even when exposed to a high-temperature environment, and can therefore be used as a laminate for an electroconductive pattern or the like.</p>
申请公布号 WO2014050657(A1) 申请公布日期 2014.04.03
申请号 WO2013JP75128 申请日期 2013.09.18
申请人 DIC CORPORATION 发明人 FUJIKAWA WATARU;SAITOU YUKIE;MURAKAWA AKIRA;SHIRAKAMI JUN
分类号 B32B27/34;B32B15/088;B32B27/18;H05K1/03;H05K3/18 主分类号 B32B27/34
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