| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device capable of restraining peel-off between a resin layer and a terminal part, a lead frame for an optical semiconductor device with a resin, a multiple mounted component of the lead frame, a multiple mounted component of the lead frame with the resin, an optical semiconductor device, and a multiple mounted component of the optical semiconductor device.SOLUTION: A lead frame 10 is used for an optical semiconductor device having a plurality of terminal parts 11, 12 in which at least one of terminal parts is connected to an LED element 2, a recess part M connected to outer peripheral sides of terminal parts 11, 12, is formed on surfaces of terminal parts 11, 12, and the recess part M has a convex part T in a position away from an inner peripheral side of the recess part M, on its bottom surface. |
