| 摘要 |
PROBLEM TO BE SOLVED: To provide a base material film of an adhesive sheet for dicing having excellent extensibility such as flexibility, stress relaxation characteristics, and breaking elongation, and used in a semiconductor wafer production process, and to provide such an adhesive sheet for dicing.SOLUTION: An acrylic resin film comprises: an acrylic resin; an acrylic soft multilayer polymer; and a thermoplastic urethane elastomer, and has tensile elasticity of 50-450 MPa, tensile fracture elongation of 200% or more, and 20% distortion stress relaxation rate of 40% or more. |
