发明名称 |
IMAGING SYSTEMS WITH CIRCUIT ELEMENT IN CARRIER WAFER |
摘要 |
An imaging system may include an image sensor package with an image sensor wafer mounted on a carrier wafer, which may be a silicon substrate. A capacitor may be formed in the carrier wafer. Trenches may be etched in a serpentine pattern in the silicon substrate. Conductive plates of the capacitor may be formed at least partially in the trenches. An insulator material may be formed between the capacitor and the silicon substrate. A dielectric layer may be formed between the conductive plates of the capacitor. The image sensor package may be mounted on a printed circuit board via a ball grid array. Conductive vias may electrically couple the capacitor and the image sensor wafer to the printed circuit board. |
申请公布号 |
US2014084407(A1) |
申请公布日期 |
2014.03.27 |
申请号 |
US201314035863 |
申请日期 |
2013.09.24 |
申请人 |
APTINA IMAGING CORPORATION |
发明人 |
CHURCHWELL SCOTT;SULTRIDGE MARC;BORTHAKUR SWARNAL |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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