发明名称 CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.
申请公布号 US2014085841(A1) 申请公布日期 2014.03.27
申请号 US201313951603 申请日期 2013.07.26
申请人 MURATA MANUFACTURING CO., LTD. 发明人 FUKUMOTO MITSUTERU
分类号 H05K1/02;H01L21/64 主分类号 H05K1/02
代理机构 代理人
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