发明名称 |
Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package |
摘要 |
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit. |
申请公布号 |
US8679865(B2) |
申请公布日期 |
2014.03.25 |
申请号 |
US20100869355 |
申请日期 |
2010.08.26 |
申请人 |
YOON SANG BOK;EOM HAE YONG;YOU MI HWA;HONG SEUNG MIN;LEE SANG HOON;KIM YONG GU;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOON SANG BOK;EOM HAE YONG;YOU MI HWA;HONG SEUNG MIN;LEE SANG HOON;KIM YONG GU |
分类号 |
H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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