| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing solution capable of polishing a metal, including aluminum and copper, sufficiently smoothly and at high speed.SOLUTION: A polishing solution for polishing a metal, including aluminum and copper, contains at least one kind of acid component selected from a group consisting of an organic acid having two or more carboxylic groups and a first acid dissociation constant of 3.00 or less, a salt of that organic acid, an anhydride of that organic acid, an inorganic acid of dibasic acid or more, and a salt of the inorganic acid, a smoothing agent, an oxidizer, colloidal silica particles, and water. In the polishing solution, corrosion potential difference of aluminum and copper is 150 mV or less. |
