发明名称 PATTERNING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a patterning method which allows for formation of a pattern on a substrate corresponding to a pattern after phase separation in a different size, a shape or a pitch, with a small number of steps.SOLUTION: In a patterning method, first and second guide patterns for subjecting a DSA material to induction self-organization are formed on a processed film on a substrate. Under first DSA conditions, a first pattern after phase separation having regularity for the first guide pattern is formed, and a first pattern on the substrate is formed by processing the processed film on the lower layer side of the first pattern after phase separation. Thereafter, under second DSA conditions, a second pattern after phase separation having regularity for the second guide pattern is formed, and a second pattern on the substrate is formed by processing the processed film on the lower layer side of the second pattern after phase separation.
申请公布号 JP2014053494(A) 申请公布日期 2014.03.20
申请号 JP20120197782 申请日期 2012.09.07
申请人 TOSHIBA CORP 发明人 MAEDA YUKITO;MOTOI TAKASHI
分类号 H01L21/027 主分类号 H01L21/027
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