MULTILAYER CERAMIC ELECTRONIC PART AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a multilayer ceramic electronic component including: a ceramic main body which includes a dielectric layer which has an average thickness of 0.6μm or less; and first and second internal electrodes which are arranged to face each other across the dielectric layer in the ceramic main body. The ceramic main body includes: a capacity formation part which contributes to a capacitance formation; and a capacity non-formation part which is provided for at least one side between the upper and lower sides of the capacity formation part. When the capacity formation part is divided into three areas in the thickness direction of the ceramic main body, the average diameter of a dielectric grain of a central area among the three areas is 150 nm or less, the number of dielectric grains per layer is more than or equal to four, the average diameter of the dielectric grain of upper and lower areas is less than or equal to 200 nm, and the number of the dielectric grains per layer is more than or equal to three.