发明名称 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
摘要 Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.
申请公布号 US8673105(B2) 申请公布日期 2014.03.18
申请号 US201213554747 申请日期 2012.07.20
申请人 KURIMURA HIROYUKI;MIYAZAKI HAYATO;NAKAJIMA GOSUKE;DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 KURIMURA HIROYUKI;MIYAZAKI HAYATO;NAKAJIMA GOSUKE
分类号 B32B37/02;B32B38/10;B32B41/00 主分类号 B32B37/02
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