| 摘要 |
PROBLEM TO BE SOLVED: To enable formation of a solder-joint portion having a sufficient re-fusion temperature and prevention of short-circuiting of adjacent electrodes even when an electrical part and an electrode of a circuit board are joined to each other under thermal press-fitting by using solder having a relatively low melting point.SOLUTION: A part mounting method comprises a step for preparing a first target having plural first electrodes, a step for preparing a second target as an electrical part having plural second electrodes, a step for supplying the first electrodes with resin-solder mixture containing granular material and thermosetting resin, the granular material containing a core containing first metal and a solder layer containing second metal having a lower melting point than the first metal, a step for mounting the second target on the first target, a step for thermally press-fitting the plural second electrodes and the corresponding first electrodes to form a joint portion containing the first metal and the second metal, and a step for heating the joint portion to promote generation of intermetallic compounds at the joint portion through mutual diffusion between the first metal and the second metal and curing the thermosetting resin. |
