Method for concentrically releasing a product substrate (e.g., a semiconductor wafer) from a support substrate by deformation of a flexible film mounted on a frame

摘要

The device is provided with a film with an adhesive layer (3s) to accommodate the product substrate in a contacting surface section (3k) of the film. The film is mounted in a mounting section (3b) encasing the contacting surface section. A separating section (3a) is placed between the contacting surface section and the mounting section. An independent claim is also included for a method for separating a product substrate from a carrier substrate.