SEMICONDUCTOR APPARATUS AND TEST METHOD THEREOF

摘要

A semiconductor device includes: a chip including a plurality of through hole vias; a test voltage input unit; and a test result receiving unit. The test voltage input unit applies a test voltage to one of the through hole vias. The test result receiving unit receives output signals outputted from one or more through hole vias. [Reference numerals] (110) Upper shifting unit; (210) Lower shifting unit; (300) Test pad