发明名称 DEVICE FOR HANDLING COMPONENTS, SUCH AS ELECTRONIC COMPONENTS, AND METHOD OF PRODUCING SAME
摘要 <p>The present invention concerns a handling device (10) for handling components (20), such as electronic components, said handling device (10) comprising a plurality of housings (112) for receiving components, characterised in that it comprises at least two holding plates (11), each holding plate (11) comprising a support (110) made from a rigid material and a plurality of studs (111) passing through said support (110), each stud (111) being made from a flexible material and comprising a through opening forming a housing (112) for receiving a component (20) in a thickness of said holding plate (11), said two holding plates being secured together in such a way that each housing (112) for receiving one of said holding plates is aligned with a housing for receiving the other of said holding plates.</p>
申请公布号 WO2014033110(A1) 申请公布日期 2014.03.06
申请号 WO2013EP67685 申请日期 2013.08.27
申请人 M.U.L MICRO USINAGE LASER 发明人 SAULNIER, CHRISTIAN;CARRIERE, CHRISTOPHE
分类号 H05K13/00;H01L21/673 主分类号 H05K13/00
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