| 摘要 |
<p>In the embodiment, a method of forming a package-on-package (PoP) device includes a step of temporally mounting a carrier on a substrate, a step of stacking a first die on the substrate, and a step of stacking a second die on the first die. The coefficient of thermal expansion of a first die or/and the substrate mismatches that of a carrier. The substrate can be formed as one among an organic substrate, a ceramic substrate, a silicon substrate, a glass substrate, and a laminate substrate</p> |
