| 摘要 |
<p>The present invention relates to an imaging device for localising structures through the surface of an object (20) such as a wafer, with a view to positioning a measuring sensor (45, 46, 47) relative to said structures, comprising: (i) an imaging sensor (22); (ii) optical imaging means (34) able to produce, on said imaging sensor (22), an image of the object (20) in a field of view; and (iii) illuminating means (23, 27) for generating an illuminating beam (25, 30) and lighting said field of view in reflection, in which the illuminating means (23, 27) are able to generate an illuminating beam (25, 30) the spectral content of which is adapted to the nature of the object (20), such that the light of said beam (25, 30) is able to essentially penetrate into said object (20). The invention also relates to a system and a method for carrying out dimensional measurements on an object (20) such as a wafer.</p> |
