发明名称 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention provides a manufacturing method of a semiconductor structure. The method comprises: a) providing a substrate; b) etching the substrate to form an opening (201) having a bottom; c) forming a metal plug (202) filling the opening (201); and d) forming a grapheme layer (300) on the substrate, the grapheme layer (300) being in contact with an upper plane of the metal plug (202). Correspondingly, the present invention further provides a semiconductor structure formed according to the above manufacturing method. According to the method and the structure, grapheme is crystallized in a predetermined area, the particle size of grapheme crystals is increased, and by using a step of optimally depositing the grapheme, the uniformity of a grapheme material is improved, thereby improving working performance and stability of the grapheme material in the semiconductor structure.</p>
申请公布号 WO2014029152(A1) 申请公布日期 2014.02.27
申请号 WO2012CN81513 申请日期 2012.09.17
申请人 INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES;LIANG, QINGQING;WANG, GUANZHONG;ZHU, HUILONG;ZHONG, HUICAI;CHEN, DAPENG;YE, TIANCHUN 发明人 LIANG, QINGQING;WANG, GUANZHONG;ZHU, HUILONG;ZHONG, HUICAI;CHEN, DAPENG;YE, TIANCHUN
分类号 H01L23/52;C23C16/26 主分类号 H01L23/52
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