| 摘要 |
Laser cutting systems (10) and methods are described herein. One or more systems include a laser generating component (102), an optical component (122), a fixture (104) for holding a support with a part (106) positioned on the support, and a control mechanism (128) for adjusting at least one of the laser generating component (102), the optical component (122), and the fixture (104) such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. |
