发明名称 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device which is improved in condensing characteristics and is further improved in characteristics such as reduction of optical color mixture, and to provide an electronic apparatus using the solid-state imaging device.SOLUTION: The solid-state imaging device includes a substrate, a plurality of photoelectric conversion parts provided in the substrate, a groove part, and an element isolation part which has an embedded film and a light shielding film and is provided between adjacent photoelectric conversion parts. The groove part has a step provided so that an opening width of the groove part becomes smaller in the depth direction of the substrate. The embedded film is embedded in the groove part so as to cover an inner wall surface of the groove part. The light shielding film is provided directly above the groove part and is at least partially embedded in the embedded film.
申请公布号 JP2014033107(A) 申请公布日期 2014.02.20
申请号 JP20120173188 申请日期 2012.08.03
申请人 SONY CORP 发明人 ENOMOTO TAKAYUKI;EBIKO YOSHIKI
分类号 H01L27/14;H01L27/146;H04N5/369;H04N5/374 主分类号 H01L27/14
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