A semiconductor device according to the present invention includes a first conductive type substrate; one or more logic cells including a second conductive type first well on the substrate; and a filler cell including a second conductive type second well connected to the first well. At least one selected from the sides of the second well as a boundary against the substrate is shaped into curved folds.
申请公布号
KR20140021252(A)
申请公布日期
2014.02.20
申请号
KR20120087373
申请日期
2012.08.09
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, HYUNG OCK;OH, CHUNG KI;WON, HYO SIG;CHOI, JUNG YUN