发明名称 |
Light emitting device, light emitting device manufacturing method, light emitting package, and lighting system |
摘要 |
A light emitting device according to an embodiment includes: a conductive support substrate; a protection layer at a periphery portion on the conductive support substrate; a light emitting structure layer on the conductive support substrate and the protection layer, wherein the light emitting structure layer includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer; and electrodes at least partially overlapping the protection layer, on the light emitting structure layer. |
申请公布号 |
EP2333852(A3) |
申请公布日期 |
2014.02.19 |
申请号 |
EP20100194055 |
申请日期 |
2010.12.07 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JEONG, HWAN LEE;LEE, SANG YOUL;SONG, JUNE O;CHOI, KWANG KI |
分类号 |
H01L33/38;H01L33/44 |
主分类号 |
H01L33/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|