发明名称 |
Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module |
摘要 |
A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member. |
申请公布号 |
US8653652(B2) |
申请公布日期 |
2014.02.18 |
申请号 |
US201013499520 |
申请日期 |
2010.08.24 |
申请人 |
TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATOH TOSHIYA;ISHIKAWA HIDEAKI;TSUYUNO NOBUTAKE;AMAGI SHIGEO;HITACHI AUTOMOTIVE SYSTEMS, LTD. |
发明人 |
TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATOH TOSHIYA;ISHIKAWA HIDEAKI;TSUYUNO NOBUTAKE;AMAGI SHIGEO |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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