| 摘要 |
A photosensitive film laminate is provided with a substrate and a photosensitive film provided on the substrate. The photosensitive film contains a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a polymerizable compound having an unsaturated double bond, and (C) a photopolymerization initiator, the (C) photopolymerization initiator having the structure expressed by general formula (1) (Ar1 represents a monovalent organic group including an aromatic, R1 represents an organic group having an alkyl or aryl group, and R2 represents a C3-50 monovalent hydrocarbon group that is any of a branched alkyl group, a straight alkyl group, an alkyl group having an alicyclic structure, or an alkyl group having an aromatic structure). It is possible to provide an exceptionally photosensitive film that can be developed in alkali, has exceptional wiring coverage even when formed into a thin film, and allows excellent visibility of an exposure part and a non-exposure part. It is also possible to provide a flexible printed wiring board using the photosensitive film. |
