| 摘要 |
A method and a device for inspecting a semiconductor package by obtaining the images of the semiconductor package and analyzing the images pick up the semiconductor package; move the semiconductor package in a horizontal direction; obtain the image of the lower surface of the semiconductor package; and align the semiconductor package using the image of the lower surface of the semiconductor package. Subsequently, the method and the device for inspecting the semiconductor package obtain first and second side images for a first side of the semiconductor package and a second side facing the first side; and analyze the first and second side images in order to determine the abnormalities of the semiconductor package. [Reference numerals] (130) Control unit |
