| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of suppressing the occurrence of nodules as much as possible and dealing with the upsizing of a treatment substrate in the sputtering apparatus, in which the surface of the treatment substrate on a side to be subjected to deposition and a target plate are opposed to each other in parallel and sputtering is performed by a magnetron sputtering system, and to provide the target plates for the sputtering apparatus. SOLUTION: The target plate is disposed along one surface of a backing plate. The target plate is respectively divided apart gaps within a range of 0.2 to 0.4 mm in a direction orthogonal to the longitudinal direction, at the center of a longitudinal direction and on both sides in the longitudinal direction. COPYRIGHT: (C)2009,JPO&INPIT |
