发明名称 METHOD AND APPARATUS TO FOLD OPTICS IN TOOLS FOR MEASURING SHAPE AND/OR THICKNESS OF A LARGE AND THIN SUBSTRATE
摘要 A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
申请公布号 WO2014022293(A1) 申请公布日期 2014.02.06
申请号 WO2013US52534 申请日期 2013.07.29
申请人 KLA-TENCOR CORPORATION 发明人 WANG, CHUNHAI;HUANG, CHUNSHENG;ZENG, ANDREW AN;GOODMAN, FREDERICK ARNOLD;TANG, SHOUHONG;ZHANG, YI
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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