发明名称 |
INCORPORATION OF PASSIVES AND FINE PITCH THROUGH VIA FOR PACKAGE ON PACKAGE |
摘要 |
This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided. |
申请公布号 |
US2014035892(A1) |
申请公布日期 |
2014.02.06 |
申请号 |
US201313748294 |
申请日期 |
2013.01.23 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
SHENOY RAVINDRA V.;LAI KWAN-YU;STEPHANOU PHILIP JASON;VELEZ MARIO FRANCISCO;KIM JONGHAE;GOUSEV EVGENI PETROVICH |
分类号 |
H01L23/538;G09G3/32;H01L25/00 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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