| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wet etching device in which the impact of reaction products, produced by reaction of an etchant and a substrate, on the etching treatment can be suppressed. SOLUTION: The wet etching device comprises an etching bath receiving the etchant. The etching bath includes an etching section where a substrate is immersed in the etchant and etched, a precipitation section disposed closer to the bottom surface side than the etching section in the etching bath, and a plurality of separators which separate the etching section and the precipitation section and having a plurality of openings interconnecting the etching section and the precipitation section. COPYRIGHT: (C)2012,JPO&INPIT |
