FLIP-CHIP BONDING NITRIDE LIGHT-EMITTING DIODE AND LIGHT-TRANSMISSION SUBSTRATE THEREOF, AND MANUFACTURING METHOD OF SAME

摘要

A substrate (16) of a flip-chip bonding nitride light-emitting diode (LED). At least one of upper and lower surfaces of the substrate (16) is a rough surface. The rough surface may be manufactured by one of five methods. Also provided is an LED component chip (10) having the substrate (16) with the rough surface. The light output and luminous efficiency of the flip-chip bonding nitride LED are improved, the whole temperature of the LED is reduced, and the reliability of a product is improved.