MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a mounting device which shortens a thermal path from a die attach pad to the outside of a package, and a method.SOLUTION: A method for manufacturing a semiconductor package by mounting an integrated circuit die 73 on a pad 70 comprises the steps of: forming a THT heat spreader pin 71 on a first surface of a pad 70; mounting an integrated circuit die 73 on a second surface facing the first surface of the pad 70; storing the integrated circuit die 73 and the pad 70 in a compound 75 with the first surface and the THT heat spreader pin 71 exposed; and mounting the THT heat spreader pin 71 on a printed circuit board 78, the THT heat spreader pin 71 being inserted through a through hole 77 formed in the printed circuit board 78. The THT heat spreader pin 71 is solidly formed with the pad 70.