METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device which prevents light absorption by adhesive material on a side face of a light-emitting element of the semiconductor light-emitting device and has high light-emitting efficiency and reduced manufacturing cost.SOLUTION: A method of manufacturing a semiconductor light-emitting device includes: a process for preparing a substrate; a process for applying adhesive material on the substrate; a placement process for placing a light-emitting element in which a groove is formed in a rear surface thereof on the adhesive material; and a process for curing the adhesive material to fix the light-emitting element to the substrate. In the placement process, the light-emitting element is placed on the adhesive material in such a manner that the rear surface of the light-emitting element is brought into contact with the adhesive material, and the adhesive material extruded from between the light-emitting element and the substrate is retained in the groove to prevent the adhesive material from exuding up to a side face of the light-emitting element.