发明名称 |
SCHOTTKY BARRIER DIODE AND METHOD FOR MANUFACTURING SCHOTTKY BARRIER DIODE |
摘要 |
A method for manufacturing a Schottky barrier diode (11) includes the following steps. First, a GaN substrate (2) is prepared. A GaN layer (3) is formed on the GaN substrate (2). A Schottky electrode (4) including a first layer made ofNi or Ni alloy and in contact with the GaN layer (3) is formed. The step of forming the Schottky electrode (4) includes a step of forming a metal layer to serve as the Schottky electrode (4) and a step of heat treating the metal layer. A region of the GaN layer (3) in contact with the Schottky electrode (4) has a dislocation density of 1×10 8 cm -2 or less. |
申请公布号 |
EP2320465(A4) |
申请公布日期 |
2014.01.22 |
申请号 |
EP20090804875 |
申请日期 |
2009.07.23 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HORII, TAKU;MIYAZAKI, TOMIHITO;KIYAMA, MAKOTO |
分类号 |
H01L29/872;H01L21/28;H01L21/329;H01L29/20;H01L29/47 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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