Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame.
申请公布号
US8629538(B2)
申请公布日期
2014.01.14
申请号
US201113316072
申请日期
2011.12.09
申请人
LEE YOUNG KI;SOHN YOUNG HO;KIM KWANG SOO;LIM CHANG HYUN;SAMSUNG ELECTRO-MECHANICS CO., LTD
发明人
LEE YOUNG KI;SOHN YOUNG HO;KIM KWANG SOO;LIM CHANG HYUN