发明名称 |
MANUFACTURING METHOD OF ELECTRONIC PACKAGING |
摘要 |
A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages. Thus, the invention has the advantages of low cost and high efficiency |
申请公布号 |
US2014007425(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213542178 |
申请日期 |
2012.07.05 |
申请人 |
LU JU-MEI;HUANG YAO-MIN;PENG JUI-CHIN;YANG SHIH-TING;HUANG CHAO-CHING;MERRY ELECTRONICS CO., LD |
发明人 |
LU JU-MEI;HUANG YAO-MIN;PENG JUI-CHIN;YANG SHIH-TING;HUANG CHAO-CHING |
分类号 |
H05K3/22 |
主分类号 |
H05K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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