| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that provides a cured product having a low dielectric constant and a dielectric tangent, and that provides a cured product in which formability is excellent at a normal press molding temperature, and further heat resistance and adhesiveness are excellent.SOLUTION: A curable resin composition includes: a polyphenylene ether (A); a crosslinking type curing agent (B); and a phosphorus-containing flame retarder (C), wherein an average phenolic hydroxyl group number per one molecule of the polyphenylene ether is at least 0.3, a resin flow amount of the curable resin composition when being cured is at least 0.3% and at most 15%, the curable resin composition provide a cured product in which a dielectric tangent at 1GHz is at most 0.007, and a glass transformation temperature is at least 160°C. |
