SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

Provided is an LED package wherein an LED element (15) is mounted in an element mounting recessed section (12) of a mounting member (11), a gap in the element mounting recessed section (12) is filled with a liquid of an insulating resin (17), and the liquid is cured, then, wiring (18) is formed on the insulating resin (17). Groove-like overflowed resin liquid retaining sections (21) are formed along the two side sections on the mounting member (11)-sides where no electrode section (14) is provided, said two side sections being among the four side sections of the mounting member, and on the upper end portions of the inner surfaces of the element mounting recessed section (12), said portions corresponding to the overflowed resin liquid retaining sections (21), overflow guide means (22) that guide resin liquid overflow to the overflowed resin liquid retaining section (21) from the element mounting recessed section (12) are formed. The gap in the element mounting recessed section (12) is filled with the insulating resin (17) up to the upper end thereof, and a region where the wiring (18) is to be formed is planarized, by fully filling the gap in the element mounting recessed section (12) with the resin liquid and curing the resin, and the resin liquid overflowed from the element mounting recessed section (12) is prevented from wet-spreading on the electrode section (14) by receiving and retaining the resin liquid in the overflowed resin liquid retaining section (21).