| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering method in which only soldering parts can be heated locally. SOLUTION: In the reflow soldering method for soldering an electronic component 6 to wiring patterns 2, 3 on a printed board 1 by reflowing a plurality of solders 4, 5 fed thereon, the plurality of solders 4, 5 are reflowed by supplying heat collectively thereto by thermal conduction using a heating piece 7. |
