| 摘要 |
Some of the embodiments of the present disclosure provide a semiconductor package structure comprising a leadframe; an interposer disposed on the leadframe, the interposer comprising a plurality of dielectric layers including at least (i) a first dielectric layer and (ii) a second dielectric layer; a semiconductor device disposed on the interposer; and a capacitor that is embedded within the interposer, wherein the capacitor is formed using at least (i) a first conductive area disposed on the first dielectric layer and (ii) a second conductive area disposed on the second dielectric layer. Other embodiments are also described and claimed. |
