| 发明名称 |
METHOD OF MANUFACTURING AN LED |
| 摘要 |
A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer prior to the back-grinding or prior after grinding the substrate in the back-grinding. |
| 申请公布号 |
KR20140001783(A) |
申请公布日期 |
2014.01.07 |
| 申请号 |
KR20130074524 |
申请日期 |
2013.06.27 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TAKAHASHI TOMOKAZU;AKIZUKI SHINYA;SUGIMURA TOSHIMASA;MATSUMURA TAKESHI;UENDA DAISUKE |
| 分类号 |
H01L33/48;H01L33/44 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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