| 摘要 |
PROBLEM TO BE SOLVED: To constitute a deflecting electrode by an electroconductive material not to yield deterioration, and form a metallized layer superior in bond strength and solder wettability and having a uniform film thickness. SOLUTION: On a surface of deflecting electrode main body 2 constituted of ceramics consisting of electroconductive oxide and sintering additives, a metallized layer composed of an adhering metallized layer 3 constituted by the electroconductive material containing at least one of Ti, Cr, Zr, Ni and a metallized layer 4 for connection constituted by the electroconductive material containing at least one of Cu, Ni, Au, Pt, Ag is installed.
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