磁控溅镀方法,申请号TW096120641-传众专利搜索

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发明名称	磁控溅镀方法
摘要
申请公布号	TWI421363	申请公布日期	2014.01.01
申请号	TW096120641	申请日期	2007.06.08
申请人	芝浦机械电子装置股份有限公司日本	发明人	宇都宫信明;伊藤昭彦
分类号	C23C14/35;C23C14/34;H01L21/203	主分类号	C23C14/35
代理机构		代理人	陈长文台北市松山区敦化北路201号7楼
主权项
地址	日本

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