| 摘要 |
<p>An illumination system has a plurality of light-emitting diode chips (R, G, B). Each light-emitting diode chip comprises a LED substrate (2) provided with a light-emitting layer (1) for emitting light. The LED chips are arranged on an optical substrate (10) with pre¬ determined optical properties. The light-emitting layer of the LEDs faces the optical substrate. Light emitted by the at least one light-emitting diode chip is being emitted via a light-egress window (11) facing away from light-emitting layer. The optical substrate comprises a heat-spreading means. Preferably, the optical substrate comprises a translucent polycrystalline ceramic material acting as heat-spreading means. Preferably, the heat- spreading means comprises a metallization layer (16) and/or a heat sink (17) applied at a side of the optical substrate facing away from the light-egress window. Preferably, the LEDs are embedded in the optical substrate.</p> |
