发明名称 PROCESS FOR ETCHING NANOMETRIC ELEMENTS UNDER CORROSIVE VAPOUR
摘要 <p>The invention relates to a process for making nanometric elements. According to the invention, the process consists in photoresist-coating some ungreased borosilicate plates by centrifugation at 1500 rpm, drying the photoressist-coated plate in an IR radiation oven at 80°C, timed exposure of the mask-covered plate to UV radiation, developing the photoresist in a 0.7% KOH solution, drying by centrifugation at 2000 rpm, drying the photoresist-coated mask in an UV radiation oven, at 120°C, etching under vapour of ammonium fluoride and hydrofluoric acid in a ratio of 1:7, followed by washing, drying and removing the photoresist mask in a solution of 10% KOH, and washing and drying again, there finally resulting a nanometric element free of impurities.</p>
申请公布号 RO126413(B1) 申请公布日期 2013.12.30
申请号 RO20090001057 申请日期 2009.12.17
申请人 OPTOELECTRONICA 2001 S.A. 发明人 NECSOIU TEODOR;IORDACHE MARIAN;PELTEACU MIHAELA;SOBETKII ARCADIE
分类号 C23C16/04;H01L21/32 主分类号 C23C16/04
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