发明名称 DIAMOND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a diamond semiconductor device and a manufacturing method of the same, which achieve a simple manufacturing process and good pn junction interface.SOLUTION: A diamond semiconductor device comprises: diamond semiconductor elements each including a diamond substrate 10 having {100} plane, a p-type diamond layer 20 formed on the substrate and an n-type diamond layer 30 grown from a stepwise base angle 50 having a lateral face of {110} plane and a bottom face of {100} plane which are formed on the substrate; and a separation region for separating the diamond semiconductor elements, which is grown from the stepwise base angle 50 having a lateral face of {100} plane and the bottom face of {100} plane which are formed on the substrate.
申请公布号 JP2013258407(A) 申请公布日期 2013.12.26
申请号 JP20130141218 申请日期 2013.07.05
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 KATO HIROMITSU;MAKINO TOSHIHARU;OGURA MASAHIKO;OGUSHI HIDEYO;YAMAZAKI SATOSHI
分类号 H01L33/34;H01L21/205;H01L21/3065;H01L33/16 主分类号 H01L33/34
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