发明名称 |
SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE |
摘要 |
A substrate structure is provided, including a substrate body and a plurality of traces formed on a surface of the substrate body. At least one of the traces has an electrical contact formed in a groove thereof for electrically connecting an external element, thereby meeting the demands of fine line/fine pitch and miniaturization and improving the product yield. |
申请公布号 |
US2013334684(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201213654780 |
申请日期 |
2012.10.18 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., L;SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
LIN CHANG-FU;CHEN CHIN-TE;YAO CHIN-TSAI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|